NICHIWA KOGYO CO.,LTD.Wafers Dicing and Backgrinding, TGV Processing of Various Glasses
JP EN

Lead in Technology

We solve our customers' problems by utilizing our advanced semiconductor processing technology and 35 years of know-how. We also provide stable quality product processing from prototype to mass production.

Features

01

Proposals/ Solutions
Proposals/ Solutions

02

Integrated Production System for Semiconductor Post Processing
Integrated Production System for Semiconductor Post Processing

03

From Prototype to Mass Production
From Prototype to Mass Production
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Service

Semiconductor Business

Semiconductor Business

So far, we have integrated backgrinding, laser marking, dicing, sorting IC chips into trays and visual inspection. From prototypes and small lots to mass production, we have established a corporate foundation that allows us to quickly respond to customer needs.

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Laser Processing Business

Laser Processing Business

TGV (micro through hole) processing and LET (laser and glass etching) processing of thin glasses. We will continue to explore processing technology every day with the goal of meeting the needs of many customers and contributing to society.

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Results

Integrated production system for semiconductor post processing. Introducing a wide variety of processing examples so far.

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  • Results
  • Backgrinding
  • Dicing

Technical commentary

Explains the mechanism of quality defects such as chipping countermeasures from the basic technology of dicing and how to deal with it.

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