Thin Glass Processing (TGV/LET)
Through Glass Vias (TGV) Processing and
Precision Glass (LET) Processing with High Bending Strength
TGV (micro through hole) processing and LET (laser and glass etching) processing of thin glasses. We will continue to explore processing technology every day with the goal of meeting the needs of many customers and contributing to society.
Features
Feature 1
Precision glass processing
by combining laser and etching (LET)
※LET(Laser & Etching Technology)
Feature 2
Achieves perfectly round
and fine TGV with damage-free holes
Feature 3
Strong bending strength (transverse strength),
chipping-less glass processing
*Irradiate and cut at a pitch of 1 to 2 μm
TGV: Through Glass Vias
An ultra-short pulse near-infrared laser modifies the interior of the glass.
Then, it cuts the glass by changing the composition.
Materials That Can Be Processed (Glass Materials)
- Soda Lime Glass
- Alkali-Free Glass
- Quartz Glass
- Composite Material (Glass + Resin Film)
Existing Device: Femtosecond Laser Equipment
Equipment | Laser Power | Wafer Size | Corresponding Thickness | Alignment Accuracy |
---|---|---|---|---|
Femtosecond Laser Equipment | 10W | φ100mm~□550×650mm | 0.2~1.1mmt | ±20μm |
Processing Samples
New Equipment: Picosecond Laser Equipment
Equipment specifications (features)
① High power picosecond laser oscillator
② High-precision alignment processing
③ Supports drawing circles, curves, rectangles, etc.
④ Conversion processing from CAD data (dxf)
Equipment | Laser Power | Wafer Size | Corresponding Thickness | Alignment Accuracy |
---|---|---|---|---|
Picosecond Laser Equipment | Equivalent to 50W | φ50mm<300mm、□370×470mm | 0.1~1.1mmt | ±10μm |
*The cutting conditions for glass differ depending on the thickness and material of the glass, so please contact us.
Processing Example
We perform laser processing and glass etching processing according to the customer’s request, and realize TGV and hollowing processing.
* Etching is processed at a subcontract factory
LET(Laser & Etching Technology)
Precision glass processing is performed by a combination of laser and glass etching (LET).
Chippingless glass processing with high bending strength (contact strength) is possible.