History
History
| Year | Events | Manufacturing Items |
|---|---|---|
| 1970 | Founded | Manufacture of Precision Turning Parts |
| 1976 | Assembly and Inspection of Watch Parts | |
| 1979 | Electrical Inspection of Semiconductor Packages | |
| 1984 | Visual Inspection of Semiconductor Bare Chips | |
| 1987 | Introduction of Ultrapure Water Production Equipment | Polishing Processing of HDD Disk Substrate Introduction of Semiconductor Dicing Processing Equipment |
| 1990 | Microscopic Examination of The Printer Head | |
| 1992 | Started Visual Inspection of Liquid Crystal Color Filters, Cleaning of Ink Pack Bags and Manufacturing of Cleaning Liquid. |
|
| 1996 | Construction of A New Factory and Expansion of Ultrapure Water Production Equipment |
Injecting Ink Into The Ink Pack |
| 1998 | Manufacturing of Ink | |
| 2000 | Acquired ISO9002 and ISO14001 Certification | Semiconductor Wafer Probe Inspection |
| 2001 | Manufacturing of KD Ink | |
| 2002 | Polishing of Liquid Crystal Glass Substrates | |
| 2003 | Expanded The Second Factory and Acquired ISO9001:2000 |
Introduced Semiconductor Wafer Back-Grinding Equipment and Started Assembling Water-Based Cartridges. |
| 2004 | Expansion of The Third Factory | Manufacture of Pigment Ink |
| 2007 | Introduced Laser Marking Equipment | |
| 2010 | Introduced Water Laser Equipment | |
| 2013 | Established NS Tech, Glass Processing | |
| 2014 | Renewal of Ultrapure Water Production Equipment | Introduced Semiconductor Wafer Rear Surface Mirror Processing Equipment (DP Method) |
| 2019 | 50th Anniversary of Foundation | Introduced Semiconductor Wafer Rear Surface Mirror Processing Equipment (CMP Method) |